| CPC H01L 21/68707 (2013.01) [B25J 11/0095 (2013.01); H01L 21/6831 (2013.01); H01L 21/6835 (2013.01); H01L 21/6838 (2013.01)] | 14 Claims |
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1. A transfer device for simultaneously or separately transferring a wafer and a consumable part having a circular shape,
wherein the consumable part is disposed in a wafer processing module, and the outer diameter of the consumable part is larger than the outer diameter of the wafer,
the transfer device comprising:
an end effector configured to place the wafer and the consumable part thereon simultaneously or separately, the end effector including a plurality of wafer support pads disposed on the upper surface of the main body;
an arm configured to move the end effector; and
circuitry configured to:
control the arm,
place the consumable part on the end effector such that the center of gravity of the consumable part coincides with a first position, in the case of transferring the consumable part, and
place the wafer on the end effector such that the center of gravity of the wafer coincides with a second position between the first position and front ends of the end effector, in the case of transferring the wafer, and
the plurality of wafer support pads are vacuum pads configured to attract and hold members by sucking air.
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