CPC H01L 21/67138 (2013.01) [B23K 20/004 (2013.01); B23K 20/005 (2013.01); H01L 21/67092 (2013.01); H01L 21/67259 (2013.01)] | 14 Claims |
1. A wire tension adjustment method, for adjusting tension applied to a wire of a wire bonding apparatus, the wire bonding apparatus comprising:
a bonding arm, rotatably attached to a bonding head and having a tip movable in an up-down direction;
a wire clamper, attached to the bonding arm, gripping and releasing the wire inserted through a bonding tool held by the tip;
a wire tensioner, applying tension to the wire by an airflow;
an air flow detector, detecting a flow rate of air supplied to the wire tensioner;
a height position detector, detecting a height position of the tip of the bonding arm; and
a spring member, generating a rotational moment in a direction opposite to a rotation direction of the bonding arm,
wherein the wire tension adjustment method comprises:
a height position detection step, in which air is supplied to the wire tensioner in a state in which the wire is gripped by the wire clamper, and the height position of the tip of the bonding arm where a rotational moment in the rotation direction of the bonding arm due to tension of the wire and the rotational moment in the direction opposite to the rotation direction of the bonding arm due to the spring member balance each other is detected by the height position detector; and
an adjustment step, in which, by adjusting the flow rate of the air supplied to the wire tensioner based on the height position detected, the tension applied to the wire is adjusted.
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