US 12,191,164 B2
Hybrid mold chase surface for semiconductor bonding and related systems and methods
Byung Hoon Moon, Taichung (TW)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Feb. 18, 2022, as Appl. No. 17/675,949.
Prior Publication US 2023/0268198 A1, Aug. 24, 2023
Int. Cl. H01L 21/56 (2006.01); B29C 33/42 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2023.01)
CPC H01L 21/565 (2013.01) [B29C 33/42 (2013.01); H01L 23/3121 (2013.01); H01L 23/49894 (2013.01); H01L 25/0657 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06562 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A mold chase for molding semiconductor devices, comprising:
a first clamp; and
a second clamp having an engaging surface facing the first clamp, wherein the engaging surface includes:
a first region having a first surface texture, the first region positioned to engage a first portion of a semiconductor substrate having electrical contacts; and
a second region adjacent the first region and having a second surface texture smoother than the first surface texture, the second region positioned to engage a second portion of the semiconductor substrate adjacent the first portion during a molding process.
 
10. A mold chase for molding semiconductor devices, comprising:
a first clamp; and
a second clamp having an engaging surface facing the first clamp, wherein the engaging surface includes:
a first region having a first surface texture, wherein the first region is positioned to engage a portion of a semiconductor substrate having electrical contacts; and
a second region adjacent to the first region and having a second surface texture smoother than the first surface texture, wherein the second region is positioned to prevent a molding compound from flowing into the first region during a molding process.