US 12,191,153 B2
Substrate processing apparatus, substrate processing system and substrate processing method
Munehisa Kodama, Kumamoto (JP); and Tomohiro Kaneko, Kumamoto (JP)
Assigned to Tokyo Electron Limited, Tokyo (JP)
Appl. No. 17/627,147
Filed by Tokyo Electron Limited, Tokyo (JP)
PCT Filed Jul. 8, 2020, PCT No. PCT/JP2020/026624
§ 371(c)(1), (2) Date Jan. 14, 2022,
PCT Pub. No. WO2021/010236, PCT Pub. Date Jan. 21, 2021.
Claims priority of application No. 2019-132256 (JP), filed on Jul. 17, 2019.
Prior Publication US 2022/0277962 A1, Sep. 1, 2022
Int. Cl. H01L 21/306 (2006.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/30604 (2013.01) [H01L 21/02057 (2013.01); H01L 21/67023 (2013.01); H01L 21/6708 (2013.01); H01L 21/68764 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A substrate processing apparatus, comprising:
a pair of first substrate chucks each configured to hold a substrate from below while allowing a first main surface of the substrate to face upwards;
a pair of second substrate chucks each configured to hold the substrate from below while allowing a second main surface of the substrate opposite to the first main surface to face upwards;
a rotary table which holds, around a vertical rotation axis thereof, a first one of the pair of first substrate chucks, a first one of the pair of second substrate chucks, a second one of the pair of first substrate chucks, and a second one of the pair of second substrate chucks in this sequence at a regular distance therebetween, and which is configured to be rotated about the rotation axis;
a first processing unit equipped with a first processing tool configured to process the first main surface of the substrate held by the first substrate chuck; and
a second processing unit equipped with a second processing tool configured to process the second main surface of the substrate held by the second substrate chuck.
 
11. A substrate processing method, comprising:
rotating a rotary table around a vertical rotation axis thereof, the rotary table holding a pair of first substrate chucks and a pair of second substrate chucks at a regular distance therebetween around the rotation axis thereof;
holding a substrate from below with each of the pair of first substrate chucks symmetrically arranged with respect to the rotation axis, while allowing a first main surface of the substrate to face upwards;
processing the first main surface of the substrate held by the first substrate chuck with a first processing unit;
holding the substrate from below with each of the pair of second substrate chucks symmetrically arranged with respect to the rotation axis, while allowing a second main surface of the substrate opposite to the first main surface to face upwards; and
processing the second main surface of the substrate held by the second substrate chuck with a second processing unit.