US 12,191,137 B2
Method for manufacturing a component arrangement for a package, method for manufacturing a package having a component arrangement, a component arrangement and a package
Simon Maus, Berlin (DE); and Ulli Hansen, Berlin (DE)
Assigned to MSG LITHOGLAS GMBH, Dresden (DE)
Appl. No. 17/618,920
Filed by MSG Lithoglas GmbH, Dresden (DE)
PCT Filed Jun. 22, 2020, PCT No. PCT/DE2020/100529
§ 371(c)(1), (2) Date Dec. 14, 2021,
PCT Pub. No. WO2020/259755, PCT Pub. Date Dec. 30, 2020.
Claims priority of application No. 102019116920.8 (DE), filed on Jun. 24, 2019; and application No. 102019118797.4 (DE), filed on Jul. 11, 2019.
Prior Publication US 2022/0415645 A1, Dec. 29, 2022
Int. Cl. H01L 21/02 (2006.01); H01L 21/78 (2006.01)
CPC H01L 21/02019 (2013.01) [H01L 21/78 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A method for manufacturing a component arrangement for a package, comprising:
providing a wafer of a semiconductor material having a polished wafer surface;
forming an opening in the wafer by anisotropic etching, wherein an anisotropically etched surface is manufactured in a region of the opening;
separating a component from the anisotropically etched wafer, wherein the separated component is manufactured having the following surfaces:
an optical surface formed in a region of a surface portion of the polished wafer surface, and
a mounting surface formed in the region of the anisotropically etched surface; and
mounting the separated component on a substrate surface of a support substrate using the mounting surface, in such a manner that the anisotropically etched surface is bonded to the substrate surface, wherein hereby the optical surface is arranged as an inclined exposed surface;
wherein the mounting surface is formed having a mounting functional layer manufactured in a region of the mounting surface, and the mounting functional layer is manufactured having a solderable metal coating.