US 12,191,118 B2
Monolithic modular microwave source with integrated process gas distribution
James Carducci, Sunnyvale, CA (US); Richard C. Fovell, San Jose, CA (US); Larry D. Elizaga, Tracy, CA (US); Silverst Rodrigues, Bangalore (IN); Vladimir Knyazik, Santa Clara, CA (US); Philip Allan Kraus, San Jose, CA (US); and Thai Cheng Chua, Cupertino, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Jan. 22, 2024, as Appl. No. 18/419,389.
Application 18/419,389 is a continuation of application No. 16/586,482, filed on Sep. 27, 2019, granted, now 11,881,384.
Prior Publication US 2024/0186118 A1, Jun. 6, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01J 37/32 (2006.01); C23C 16/455 (2006.01); C23C 16/511 (2006.01)
CPC H01J 37/3244 (2013.01) [C23C 16/45559 (2013.01); C23C 16/45561 (2013.01); C23C 16/511 (2013.01); H01J 2237/3321 (2013.01); H01J 2237/334 (2013.01); H01J 2237/335 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A conductive plate configured to be used in a lid assembly of a microwave source, comprising: a electrically conductive body having a plurality of openings there through, each opening configured to receive a dielectric resonator; wherein the electrically conductive body comprises a first surface mateable with a lid plate and a second surface mateable with a showerhead to form the lid assembly; a plurality of gas distribution channels disposed into the second surface of the electrically conductive body; wherein each of the plurality of gas distribution channels extends from proximate an outer edge of the electrically conductive body toward an axial center of the electrically conductive body along straight and curved paths and includes: a cover, at least one first hole extending from a channel to the first surface, and a plurality of second holes extending through the cover.