US 12,191,083 B2
Multilayer electronic component
Su Ji Kang, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Nov. 17, 2022, as Appl. No. 17/989,176.
Claims priority of application No. 10-2021-0184078 (KR), filed on Dec. 21, 2021.
Prior Publication US 2023/0197341 A1, Jun. 22, 2023
Int. Cl. H01G 4/224 (2006.01); H01G 4/005 (2006.01); H01G 4/30 (2006.01)
CPC H01G 4/224 (2013.01) [H01G 4/005 (2013.01); H01G 4/30 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A multilayer electronic component comprising:
a body including a plurality of dielectric layers and including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction;
a side margin portion disposed on fifth and sixth surfaces; and
external electrodes disposed on the third and fourth surfaces,
wherein the body includes an active portion having internal electrodes alternately arranged with the dielectric layer interposed therebetween in the first direction and a cover portion disposed on both end surfaces of the active portion in the first direction,
the active portion, the cover portion, and the side margin portion include molybdenum (Mo), and
a Mo content in an interfacial portion, a region of the active portion, adjacent to one of the cover portion and the side margin portion, is higher than a Mo content in a central portion of the active portion.