US 12,191,081 B2
Multilayer electronic component
Eung Seok Lee, Suwon-si (KR); Tae Gyun Kwon, Suwon-si (KR); and Yun Sung Kang, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Oct. 27, 2023, as Appl. No. 18/384,807.
Application 18/384,807 is a continuation of application No. 17/830,946, filed on Jun. 2, 2022, granted, now 11,837,406.
Claims priority of application No. 10-2022-0013951 (KR), filed on Feb. 3, 2022.
Prior Publication US 2024/0055183 A1, Feb. 15, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01G 4/008 (2006.01); H01G 4/12 (2006.01); H01G 4/30 (2006.01)
CPC H01G 4/0085 (2013.01) [H01G 4/1209 (2013.01); H01G 4/30 (2013.01); H01G 4/306 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A multilayer electronic component comprising:
a body including a plurality of internal electrodes and a dielectric layer disposed between the plurality of internal electrodes; and
an external electrode disposed on the body and connected to the plurality of internal electrodes,
wherein each of the plurality of internal electrodes includes a plurality of metal layers, and an electrically conductive heterogeneous material layer disposed between the plurality of metal layers.