US 12,191,080 B2
Multilayer ceramic electronic component
Woong Gi Kang, Suwon-si (KR); Hyung Joon Jeon, Suwon-si (KR); Ji Seop Oh, Suwon-si (KR); Jeong Ryeol Kim, Suwon-si (KR); and Eun Jung Kim, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Nov. 9, 2022, as Appl. No. 17/983,850.
Claims priority of application No. 10-2021-0188004 (KR), filed on Dec. 27, 2021.
Prior Publication US 2023/0207194 A1, Jun. 29, 2023
Int. Cl. H01G 4/005 (2006.01); H01G 4/10 (2006.01); H01G 4/30 (2006.01)
CPC H01G 4/005 (2013.01) [H01G 4/10 (2013.01); H01G 4/30 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A multilayer ceramic electronic component comprising:
a body including a dielectric layer and an internal electrode; and
an external electrode disposed on the exterior of the body,
wherein the dielectric layer includes a plurality of dielectric grains and a grain boundary present between the dielectric grains, and
a molar ratio (Al/Ti) of Al and Ti included in the grain boundary satisfies 0.022 to 0.028.