US 12,190,628 B2
Fingerprint identification module, method for manufacturing fingerprint identification module, display substrate and display device
Nianqi Yao, Beijing (CN); and Lubin Shi, Beijing (CN)
Assigned to BOE Technology Group Co., Ltd., Beijing (CN)
Appl. No. 17/431,636
Filed by BOE Technology Group Co., Ltd., Beijing (CN)
PCT Filed Feb. 9, 2021, PCT No. PCT/CN2021/076187
§ 371(c)(1), (2) Date Aug. 17, 2021,
PCT Pub. No. WO2021/164641, PCT Pub. Date Aug. 26, 2021.
Claims priority of application No. 202010098804.5 (CN), filed on Feb. 18, 2020.
Prior Publication US 2022/0100982 A1, Mar. 31, 2022
Int. Cl. H01L 27/144 (2006.01); G06F 21/32 (2013.01); G06V 40/13 (2022.01); H01L 27/146 (2006.01)
CPC G06V 40/1318 (2022.01) [G06F 21/32 (2013.01); H01L 27/1443 (2013.01); H01L 27/14643 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A fingerprint identification module, comprising:
a thin film transistor (TFT), a photosensitive sensor, and a connection electrode configured to connect the TFT to the photosensitive sensor,
wherein the TFT comprises an active layer;
the active layer and the connection electrode are formed through a same semiconductor layer pattern, the semiconductor layer pattern comprises a first semiconductor pattern and a second semiconductor pattern, the first semiconductor pattern is used as the active layer, and the second semiconductor pattern is subjected to conductor-formation treatment and used as the connection electrode;
wherein the TFT comprises a gate electrode, and the gate electrode is arranged at a same layer, and made of a same material, as the first electrode of the photosensitive sensor.