a sensing die and a secure element die electrically coupled to the sensing die;

a fingerprint sensor electrically coupled to the sensing die;

a single mold material encapsulating both the sensing die and the secure element die; and

a land grid array layer electrically coupled to the sensing die and the secure element die, the land grid array layer comprising a plurality of contacts exposed at a surface of the sensor package and configured to electrically couple to a corresponding plurality of contacts of a socket,

wherein the land grid array layer, the fingerprint sensor, and the mold material each comprise a common footprint.