US 12,190,188 B2
Prelam body of a smart card, method of forming a prelam body of a smart card, and a smart card
Lars Klemm, Dresden (DE)
Assigned to LINXENS HOLDING, Mantes la Jolie (FR)
Appl. No. 18/025,837
Filed by LINXENS HOLDING, Mantes la Jolie (FR)
PCT Filed Sep. 25, 2020, PCT No. PCT/IB2020/000793
§ 371(c)(1), (2) Date Mar. 10, 2023,
PCT Pub. No. WO2022/064233, PCT Pub. Date Mar. 31, 2022.
Prior Publication US 2023/0359856 A1, Nov. 9, 2023
Int. Cl. G06K 19/077 (2006.01)
CPC G06K 19/07745 (2013.01) [G06K 19/07722 (2013.01); G06K 19/07783 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A prelam body of a smart card, the prelam body comprising:
a prelam body substrate having an IC landing area provided on a first main surface of the prelam body substrate, the IC landing area having at least one contact pad and at least one dummy island, wherein the at least one contact pad is electrically coupled with at least one conductive line routed in or on the prelam body substrate and the at least one dummy island is electrically isolated from any conductive element in the prelam body substrate; and
a chip having at least one contact element arranged on a second main surface of the chip, the at least one contact element being in electric connection with the at least one contact pad,
wherein the chip is flip chip bonded to the prelam body substrate such that the first main surface and the second main surface face each other and that the chip at least partially overlies the at least one contact pad and the at least one dummy island for supporting the chip on the prelam body substrate.