US 12,190,038 B1
Multi-chip module (MCM) with multi-port unified memory
Ramin Farjadrad, Los Altos, CA (US)
Assigned to Eliyan Corporation, Santa Clara, CA (US)
Filed by Eliyan Corporation, Santa Clara, CA (US)
Filed on Jan. 23, 2024, as Appl. No. 18/420,006.
Application 18/420,006 is a continuation in part of application No. 17/994,123, filed on Nov. 25, 2022, granted, now 11,893,242.
Claims priority of provisional application 63/532,908, filed on Aug. 16, 2023.
Claims priority of provisional application 63/283,265, filed on Nov. 25, 2021.
This patent is subject to a terminal disclaimer.
Int. Cl. G06F 30/392 (2020.01); G06F 115/12 (2020.01)
CPC G06F 30/392 (2020.01) [G06F 2115/12 (2020.01)] 34 Claims
OG exemplary drawing
 
1. A chiplet-based multi-chip module (MCM) to mount to a base substrate, the chiplet-based MCM comprising:
a package substrate that is separate from the base substrate;
a micro-bump advanced-package routing layer coupled to a portion of the package substrate;
a first integrated circuit (IC) chiplet coupled to the micro-bump advanced-package routing layer;
a first memory chiplet coupled to the micro-bump advanced-package routing layer and comprising
a first port interface to couple to the first IC chiplet via a first set of traces formed in the micro-bump advanced-package routing layer;
a second port interface to couple to an on-package chiplet device; and
wherein a transaction between the first IC chiplet and the on-package chiplet device passes through the first port interface and the second port interface of the first memory chiplet.