US 12,189,945 B2
Z-axis compression connector coupling for memory modules
Arnold Thomas Schnell, Hutto, TX (US)
Assigned to Dell Products L.P., Round Rock, TX (US)
Filed by DELL PRODUCTS L.P., Round Rock, TX (US)
Filed on Jul. 6, 2022, as Appl. No. 17/858,396.
Application 17/858,396 is a continuation in part of application No. 17/458,895, filed on Aug. 27, 2021, granted, now 11,789,877.
Prior Publication US 2023/0060406 A1, Mar. 2, 2023
Int. Cl. G06F 3/06 (2006.01)
CPC G06F 3/0608 (2013.01) [G06F 3/064 (2013.01); G06F 3/0673 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A memory module mounting apparatus for coupling a memory module to a processor of an information handling system, the apparatus comprising:
a z-axis compression connector having first compression contacts on a first surface of the compression connector, and second compression contacts on a second surface of the compression connector, the first compression contacts being configured to couple the compression connector to the processor; and
a compression connector mount having first contact pads on a first surface of the compression connector mount, the first contact pads configured to couple the compression connector mount to the first compression contacts, and having contact elements configured to couple the contact pads to the memory module.