US 12,189,455 B2
Semiconductor device, communication system and packet transmission method
Takayuki Suzuki, Tokyo (JP)
Assigned to RENESAS ELECTRONICS CORPORATION, Tokyo (JP)
Filed by RENESAS ELECTRONICS CORPORATION, Tokyo (JP)
Filed on Nov. 3, 2022, as Appl. No. 18/052,387.
Claims priority of application No. 2021-186708 (JP), filed on Nov. 16, 2021.
Prior Publication US 2023/0152876 A1, May 18, 2023
Int. Cl. G06F 1/32 (2019.01); G06F 1/3234 (2019.01); G06F 13/40 (2006.01)
CPC G06F 1/3253 (2013.01) [G06F 13/4004 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A semiconductor device comprising:
a controller including a first interface circuit in conformity with UTMI+ standards;
a converting circuit including a second interface circuit in conformity with the UTMI+ standards and a third interface circuit in conformity with ULPI standards, the second interface circuit converting data transmitted from the first interface circuit and received and the third interface circuit transmitting the converted data;
a first circuit analyzing a packet output from the controller and identifying and holding a packet identifier contained in the packet; and
a second circuit providing a transmission command, after which a data string containing a packet identifier indicating LPM (Link Power Management) bringing a USB device to a low power consumption state is added, if the first circuit determines that the packet identifier is the LPM.