US 12,189,442 B2
Method for detecting heat dissipation and electronic device
Kun-Hsin Chiang, Taipei (TW); Yu-Chieh Chang, Taipei (TW); Tang-Hui Liao, Taipei (TW); Wei-Hsian Chang, Taipei (TW); Wen-Yen Hsieh, Taipei (TW); Chih-Wei Kuo, Taipei (TW); Ming-Yi Huang, Taipei (TW); Ching-Chan Chu, Taipei (TW); and Shun-Po Chang, Taipei (TW)
Assigned to ASUSTeK COMPUTER INC., Taipei (TW)
Filed by ASUSTeK COMPUTER INC., Taipei (TW)
Filed on Apr. 21, 2022, as Appl. No. 17/725,570.
Claims priority of application No. 110115342 (TW), filed on Apr. 28, 2021.
Prior Publication US 2022/0350384 A1, Nov. 3, 2022
Int. Cl. G06F 1/20 (2006.01); G06F 1/28 (2006.01); H05K 7/20 (2006.01)
CPC G06F 1/206 (2013.01) [G06F 1/28 (2013.01); H05K 7/2039 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A method for detecting heat dissipation, comprising:
sensing a core temperature of a heat emitting component of an electronic device;
sensing current power of the heat emitting component when the core temperature is greater than or equal to a warning temperature;
determining whether power of the heat emitting component reached a warning power level once when the current power is less than thermal design power (TDP) of the heat emitting component, wherein the warning power level is greater than the TDP; and
transmitting an assembling check prompt and activating a thermal control circuit (TCC) when the power of the heat emitting component reached the warning power level once.