US 12,189,441 B2
3-D structured two-phase microfluidic cooling with nano structured boiling enhancement coating
Bharath Ramakrishnan, Bellevue, WA (US); Husam Atallah Alissa, Redmond, WA (US); Eric C. Peterson, Woodinville, WA (US); Christian L. Belady, Mercer Island, WA (US); Dennis Trieu, Calgary (CA); Ioannis Manousakis, Redmond, WA (US); Nicholas Andrew Keehn, Kirkland, WA (US); Kathryn M. Oseen-Senda, Seattle, WA (US); and Douglas Patrick Kelley, Sammamish, WA (US)
Assigned to Microsoft Technology Licensing, LLC, Redmond, WA (US)
Filed by Microsoft Technology Licensing, LLC, Redmond, WA (US)
Filed on Apr. 20, 2022, as Appl. No. 17/725,428.
Prior Publication US 2023/0341910 A1, Oct. 26, 2023
Int. Cl. H05K 7/20 (2006.01); G06F 1/20 (2006.01)
CPC G06F 1/206 (2013.01) [H05K 7/203 (2013.01); H05K 7/20327 (2013.01); H05K 7/20336 (2013.01); H05K 7/20381 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A processor comprising:
a first die;
a second die connected to the first die with a microfluidic volume positioned between the first die and the second die; and
a wicking heat spreader positioned in the microfluidic volume, the wicking heat spreader comprising:
a wicking portion having one or more channels configured to draw a liquid phase of a working fluid into the wicking portion; and
a boiling enhancement surface feature positioned on an interior surface of at least one of the one or more channels of the wicking portion.