US 12,189,294 B2
Resist underlayer film-forming composition having diol structure
Satoshi Kamibayashi, Toyama (JP); and Yuki Endo, Toyama (JP)
Assigned to NISSAN CHEMICAL CORPORATION, Tokyo (JP)
Appl. No. 17/928,534
Filed by NISSAN CHEMICAL CORPORATION, Tokyo (JP)
PCT Filed Jun. 11, 2021, PCT No. PCT/JP2021/022278
§ 371(c)(1), (2) Date Nov. 29, 2022,
PCT Pub. No. WO2021/251482, PCT Pub. Date Dec. 16, 2021.
Claims priority of application No. 2020-102046 (JP), filed on Jun. 12, 2020.
Prior Publication US 2023/0205086 A1, Jun. 29, 2023
Int. Cl. G03F 7/11 (2006.01); H01L 21/027 (2006.01)
CPC G03F 7/11 (2013.01) [H01L 21/0274 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A resist underlayer film-forming composition comprising:
a compound represented by the following Formula (1) and having a theoretical molecular weight of 999 or less; and
an organic solvent:

OG Complex Work Unit Chemistry
in Formula (1), Z1 contains a nitrogen-containing heterocyclic ring; U is a monovalent organic group represented by the following Formula (2); and p represents an integer of 2 to 4,

OG Complex Work Unit Chemistry
in Formula (2), R1 represents an alkylene group having 1 to 4 carbon atoms; A1 to A3 each independently represent a hydrogen atom, a methyl group, or an ethyl group; X represents any of —COO—, —OCO—, —O—, —S—, or —NRa—, Ra represents a hydrogen atom or a methyl group; Y represents a direct bond or an alkylene group having 1 to 4 carbon atoms which may be substituted; R2, R3, and R4 are each independently a hydrogen atom, or an alkyl group having 1 to 10 carbon atoms which may be substituted or an aryl group having 6 to 40 carbon atoms which may be substituted; R5 is a hydrogen atom or a hydroxy group; n represents an integer of 0 or 1; m1 represents an integer of 0 or 1; m2 represents an integer of 1; and * represents a binding site to Z1.