	US 12,189,290 B2
	Photosensitive resin composition, dry film using same, printed wiring board, and printed wiring board manufacturing method
Nobuhito Komuro, Tokyo (JP); Yuta Daijima, Tokyo (JP); Masayuki Kojima, Tokyo (JP); Shinji Irizawa, Tokyo (JP); and Shinya Oosaki, Tokyo (JP)
Assigned to Resonac Corporation, Tokyo (JP)
Filed by Resonac Corporation, Tokyo (JP)
Filed on Jul. 11, 2023, as Appl. No. 18/220,308.
Application 18/220,308 is a continuation of application No. 16/497,600, granted, now 11,921,424, previously published as PCT/JP2017/013342, filed on Mar. 30, 2017.
Prior Publication US 2023/0350292 A1, Nov. 2, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. G03F 7/031 (2006.01); G03F 7/029 (2006.01); G03F 7/032 (2006.01); G03F 7/038 (2006.01); G03F 7/40 (2006.01); H05K 3/00 (2006.01)

CPC G03F 7/031 (2013.01) [G03F 7/029 (2013.01); G03F 7/032 (2013.01); G03F 7/0382 (2013.01); G03F 7/0385 (2013.01); G03F 7/40 (2013.01); H05K 3/0076 (2013.01)]

18 Claims

1. A photosensitive resin composition comprising:

an acid-modified vinyl group-containing epoxy resin (A);

a photopolymerization initiator (B);

a photopolymerization sensitizer containing a benzophenone compound (C); and

a photopolymerizable compound (D), wherein

a content of the component (A) is in a range of 20 to 80 mass % with respect to a total solid content of the photosensitive resin composition,

the photopolymerization initiator (B) is at least one selected from the group consisting of an alkylphenone photopolymerization initiator, an acylphosphine oxide photopolymerization initiator, a titanocene photopolymerization initiator, and an oxime ester photopolymerization initiator, and

the benzophenone compound contained in the component (C) is a benzophenone compound having at least one group selected from the group consisting of an amino group, an ethylamino group, a dimethylamino group, a diethylamino group, a dibutylamino group, a hydroxyl group, a methoxy group, an ethoxy group, a butoxy group, and a phenyl group.