US 12,189,085 B2
Imaging device
Atsushi Yamamoto, Kanagawa (JP); and Kensaku Maeda, Kanagawa (JP)
Assigned to SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
Appl. No. 17/595,917
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
PCT Filed May 25, 2020, PCT No. PCT/JP2020/020581
§ 371(c)(1), (2) Date Nov. 29, 2021,
PCT Pub. No. WO2020/246293, PCT Pub. Date Dec. 10, 2020.
Claims priority of application No. 2019-105899 (JP), filed on Jun. 6, 2019.
Prior Publication US 2022/0236454 A1, Jul. 28, 2022
Int. Cl. G02B 1/11 (2015.01); G02B 3/04 (2006.01); G02B 7/02 (2021.01); G02B 27/00 (2006.01)
CPC G02B 1/11 (2013.01) [G02B 3/04 (2013.01); G02B 7/021 (2013.01); G02B 27/0018 (2013.01)] 14 Claims
OG exemplary drawing
 
1. An imaging device, comprising:
a solid-state imaging element including a laminate substrate, wherein
the laminate substrate includes a first substrate and a second substrate,
and
the first substrate and the second substrate are laminated;
a glass substrate above the first substrate, wherein
the glass substrate includes a first glass substrate and a second glass substrate, and
the first glass substrate is bonded to the second glass substrate;
a lens on the glass substrate; and
a cavity between the lens and the solid-state imaging element.