US 12,189,003 B2
Magnetic sensor
Hirokazu Takahashi, Tokyo (JP); and Kenzo Makino, Tokyo (JP)
Assigned to TDK CORPORATION, Tokyo (JP)
Filed by TDK CORPORATION, Tokyo (JP)
Filed on Nov. 22, 2023, as Appl. No. 18/517,863.
Application 18/517,863 is a continuation of application No. 17/569,097, filed on Jan. 5, 2022, granted, now 11,860,251.
Claims priority of application No. 2021-005794 (JP), filed on Jan. 18, 2021.
Prior Publication US 2024/0094315 A1, Mar. 21, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. G01R 33/09 (2006.01)
CPC G01R 33/098 (2013.01) [G01R 33/093 (2013.01)] 26 Claims
OG exemplary drawing
 
1. A magnetic sensor comprising a magnetoresistive element, wherein:
the magnetoresistive element includes a magnetic layer having a magnetization whose direction is variable;
the magnetic layer has a first surface and a second surface located opposite the first surface, and has a thickness that is a dimension in a direction perpendicular to the first surface of the magnetic layer;
the first surface has a first edge and a second edge located at both ends in a first direction; and
in a given cross section intersecting the magnetic layer and perpendicular to a second direction intersecting the first direction, the thickness at the first edge is smaller than the thickness at a predetermined point on the first surface between the first edge and the second edge.