US 12,188,978 B2
Probe structure for micro device inspection
Gholamreza Chaji, Waterloo (CA); and Chang Ho Park, Burlington (CA)
Assigned to VueReal Inc., Waterloo (CA)
Appl. No. 17/432,575
Filed by VueReal Inc., Waterloo (CA)
PCT Filed Feb. 20, 2020, PCT No. PCT/IB2020/051450
§ 371(c)(1), (2) Date Aug. 20, 2021,
PCT Pub. No. WO2020/170201, PCT Pub. Date Aug. 27, 2020.
Claims priority of provisional application 62/808,593, filed on Feb. 21, 2019.
Prior Publication US 2022/0003815 A1, Jan. 6, 2022
Int. Cl. G01R 1/067 (2006.01); G01R 1/073 (2006.01); G01R 31/28 (2006.01)
CPC G01R 31/2891 (2013.01) [G01R 1/06794 (2013.01); G01R 1/07342 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A probe card assembly comprising:
a substrate;
one or more probe units provided on the substrate, wherein each probe unit comprises:
a force sensor integrated on the substrate;
a bridge formed over the force sensor; and
a probe having a probe tip connected to the bridge, wherein the probe is biased to allow measuring of at least one attribute of a micro device disposed on a wafer.