	US 12,188,692 B2
	Thermal management device and system
Reza Monazami, Boston, MA (US); Sahar Jahani, Boston, MA (US); and Nicholas Keith Anselmo, Yorktown, VA (US)
Assigned to BLUEXTHERMAL, INC., Cambridge, MA (US)
Filed by BLUEXTHERMAL, INC., Cambridge, MA (US)
Filed on Aug. 11, 2023, as Appl. No. 18/448,805.
Application 18/448,805 is a continuation of application No. 16/936,358, filed on Jul. 22, 2020, granted, now 11,768,016.
Claims priority of provisional application 62/877,122, filed on Jul. 22, 2019.
Claims priority of provisional application 62/954,759, filed on Dec. 30, 2019.
Prior Publication US 2023/0392833 A1, Dec. 7, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. F25B 21/02 (2006.01); A61B 18/00 (2006.01); A61B 18/20 (2006.01); A61F 7/00 (2006.01); F28D 15/02 (2006.01); F28D 15/04 (2006.01); H01L 23/38 (2006.01); H10N 10/00 (2023.01); H10N 10/13 (2023.01); H10N 10/17 (2023.01)

CPC F25B 21/02 (2013.01) [A61B 18/203 (2013.01); A61F 7/007 (2013.01); F28D 15/0233 (2013.01); F28D 15/0275 (2013.01); F28D 15/046 (2013.01); H01L 23/38 (2013.01); H10N 10/00 (2023.02); H10N 10/13 (2023.02); H10N 10/17 (2023.02); A61B 2018/00452 (2013.01); A61F 2007/0075 (2013.01)]

19 Claims

1. A thermal management system, comprising:

a thermoelectric component having a first side configured to be thermally coupled to a target material and a second side opposite the first side;

a heat transfer unit thermally coupled to the second side of the thermoelectric component, the heat transfer unit comprising (i) a chamber including an inlet region and an outlet region, and (ii) microfeatures in the chamber spaced apart from each other such that, in operation, a working fluid is directed between the microfeatures from the inlet region toward the outlet region; and

a controller configured to operate the thermoelectric component and the heat transfer unit such that the heat transfer unit cools the second side of the thermoelectric component to a first temperature, wherein the thermoelectric component is configured to change the temperature of the target material to a second temperature within a range of 0.5 to 20 seconds, and wherein the second temperature is within a range of +/−60° C. of the first temperature.

13. A semiconductor device, comprising:

a semiconductor component; and

a thermal management system comprising:

a thermoelectric component including a first side configured to be thermally coupled to the semiconductor component and a second side opposite the first side;

a heat transfer unit thermally coupled to the second side of the thermoelectric component, the heat transfer unit comprising (i) a chamber including an inlet region and an outlet region, and (ii) microfeatures in the chamber that are spaced apart from each other such that, in operation, a working fluid is directed between the microfeatures from the inlet region of the chamber to the outlet of the chamber; and

19. A thermal management system, comprising:

a thermoelectric component having a first side configured to be thermally coupled to a target material and a second side opposite the first side;

a heat transfer unit in contact with and thermally coupled to the second side of the thermoelectric component, the heat transfer unit comprising a chamber including microfeatures, an inlet region, and an outlet region, wherein the chamber is configured to receive a working fluid that flows from the inlet region toward the outlet region, such that the working fluid absorbs heat from the thermoelectric component and transfers heat to the chamber; and

a controller configured to operate the thermoelectric component and the heat transfer unit such that the heat transfer unit cools the second side of the thermoelectric component to a first temperature and the thermoelectric component changes the temperature of the target material to a second temperature within a range of 0.5 to 20 seconds, and wherein the second temperature is within a range of +/−60° C. of the first temperature.