US 12,188,173 B2
Clothing processing apparatus
Junyoung Choi, Seoul (KR); Wansik Nam, Seoul (KR); Sunghoo Park, Seoul (KR); and Hyeyong Park, Seoul (KR)
Assigned to LG Electronics Inc., Seoul (KR)
Appl. No. 17/270,783
Filed by LG Electronics Inc., Seoul (KR)
PCT Filed Aug. 23, 2019, PCT No. PCT/KR2019/010754
§ 371(c)(1), (2) Date Feb. 23, 2021,
PCT Pub. No. WO2020/045902, PCT Pub. Date Mar. 5, 2020.
Claims priority of provisional application 62/722,990, filed on Aug. 27, 2018.
Prior Publication US 2021/0340704 A1, Nov. 4, 2021
Int. Cl. D06F 73/02 (2006.01); D06F 73/00 (2006.01); G10L 15/22 (2006.01)
CPC D06F 73/02 (2013.01) [D06F 73/00 (2013.01); G10L 15/22 (2013.01); G10L 2015/223 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A laundry treating apparatus comprising:
a cabinet that defines an inlet;
a first chamber provided inside the cabinet and configured to accommodate laundry, the first chamber being fluidly connected to the inlet;
a second chamber provided in the cabinet, the second chamber being partitioned from the first chamber;
a supply module provided inside the second chamber and configured to supply at least one of air or water to the first chamber;
a door having that is rotatably coupled to the cabinet and configured to open and close the inlet;
a controller configured to control the supply module; and
a voice recognition module disposed on the door, the voice recognition module being configured to recognize a voice generated by a user and to transmit a control command corresponding to the recognized voice to the controller,
wherein the voice recognition module includes:
a chamber forming module that protrudes from and is installed on any one of an upper surface, a side surface, or a lower surface of the door, the chamber forming module protruding to an outside of the door and being exposed to a front of the door,
a microphone disposed inside the chamber forming module and disposed on the any one of the upper surface, the side surface, or the lower surface of the door, and
a communication hole defined at a front surface of the chamber forming module.