CPC C23C 16/509 (2013.01) [H01J 37/32568 (2013.01); H01J 2237/036 (2013.01)] | 10 Claims |
1. A substrate processing apparatus comprising:
a process chamber configured to provide a reaction space in which a substrate is processed;
a first electrode disposed within the process chamber and including a plurality of protruding electrodes facing and protruding toward the substrate; and
a second electrode disposed within the process chamber and provided with a plurality of insertion holes into which the protruding electrodes are inserted,
wherein the second electrode has a central area, a peripheral area surrounding the central area, and an edge area surrounding the peripheral area,
wherein the protruding electrodes are inserted into the insertion holes such that centers of the protruding electrodes are aligned with centers of the insertion holes in the central area, the centers of the protruding electrodes are spaced apart from the centers of the insertion holes along a direction to which the second electrode extends by a first distance in directions away from the central area in the peripheral area, and the centers of the protruding electrodes are spaced apart from the centers of the insertion holes along the direction to which the second electrode extends by a second distance in directions away from the central area in the edge area, and
wherein the first distance is shorter than the second distance.
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