US 12,187,943 B2
Chemical solution used for cleaning or etching ruthenium-containing layer and method for fabricating ruthenium wiring
Yukihisa Wada, Kawasaki (JP); Shinya Koga, Kawasaki (JP); and Kazuhiro Takahashi, Kawasaki (JP)
Assigned to TOKYO OHKA KOGYO CO., LTD., Kawasaki (JP)
Filed by TOKYO OHKA KOGYO CO., LTD., Kawasaki (JP)
Filed on Jan. 13, 2022, as Appl. No. 17/574,974.
Claims priority of application No. 2021-015480 (JP), filed on Feb. 3, 2021.
Prior Publication US 2022/0243127 A1, Aug. 4, 2022
Int. Cl. C09K 13/00 (2006.01); C11D 1/75 (2006.01); C11D 3/04 (2006.01); C11D 3/20 (2006.01); C11D 3/28 (2006.01); C11D 3/30 (2006.01); C11D 3/36 (2006.01); H05K 3/10 (2006.01)
CPC C09K 13/00 (2013.01) [C11D 1/75 (2013.01); C11D 3/044 (2013.01); C11D 3/2079 (2013.01); C11D 3/28 (2013.01); C11D 3/30 (2013.01); C11D 3/361 (2013.01); H05K 3/107 (2013.01); C11D 2111/20 (2024.01); Y10T 29/49155 (2015.01)] 11 Claims
 
1. A chemical solution for use in cleaning or etching a ruthenium-containing layer, comprising:
orthoperiodic acid (A);
a base component (B); and
a compound (C) selected from the group consisting of a nitrogen-containing heterocyclic compound, an organic phosphonic acid, and an organic carboxylic acid,
wherein the base component (B) does not correspond to any one of the compound (C), a pH buffer component (D), and an organic amine oxide (E).