	US 12,187,931 B2
	Release film for pressure-sensitive silicone adhesive and production method therefor
Koichi Yamaguchi, Annaka (JP); and Yuji Yamane, Annaka (JP)
Assigned to SHIN-ETSU CHEMICAL CO., LTD., Tokyo (JP)
Appl. No. 17/050,039
Filed by SHIN-ETSU CHEMICAL CO., LTD., Tokyo (JP)
PCT Filed Apr. 4, 2019, PCT No. PCT/JP2019/014903 § 371(c)(1), (2) Date Oct. 23, 2020, PCT Pub. No. WO2019/208141, PCT Pub. Date Oct. 31, 2019.
Claims priority of application No. 2018-082740 (JP), filed on Apr. 24, 2018.
Prior Publication US 2021/0238453 A1, Aug. 5, 2021
Int. Cl. B32B 27/00 (2006.01); C08G 65/00 (2006.01); C08G 65/22 (2006.01); C08G 65/336 (2006.01); C08G 77/00 (2006.01); C08G 77/14 (2006.01); C09J 7/38 (2018.01); C09J 7/40 (2018.01); C09J 7/50 (2018.01)

CPC C09J 7/401 (2018.01) [B32B 27/00 (2013.01); C08G 65/007 (2013.01); C08G 65/226 (2013.01); C08G 65/336 (2013.01); C08G 77/00 (2013.01); C08G 77/14 (2013.01); C09J 7/38 (2018.01); C09J 7/40 (2018.01); C09J 7/403 (2018.01); C09J 7/50 (2018.01); C09J 2427/005 (2013.01); C09J 2483/003 (2013.01)]

12 Claims

1. A release film adapted for silicone pressure-sensitive adhesive, comprising a substrate, a primer layer disposed on at least one surface of the substrate as a first layer, and a release layer disposed on the outer surface of the primer layer as a second layer,

the substrate having a thickness of 10 to 200 μm,

the primer layer comprising an organosilicon compound having a plurality of silanol groups per molecule and having a thickness of 0.5 to 500 nm,

the release layer comprising a cured product of a hydrolyzable fluorinated compound and having a thickness of 0.5 to 30 nm.