US 12,187,919 B2
Polishing slurry composition
Jin Sook Hwang, Gyeonggi-do (KR); Hyun Goo Kong, Gyeonggi-do (KR); and Yun Su Kim, Gyeonggi-do (KR)
Assigned to KCTECH Co., Ltd., (KR)
Filed by KCTECH CO., LTD., Gyeonggi-do (KR)
Filed on Dec. 16, 2021, as Appl. No. 17/552,932.
Claims priority of application No. 10-2020-0178827 (KR), filed on Dec. 18, 2020.
Prior Publication US 2022/0195243 A1, Jun. 23, 2022
Int. Cl. C09G 1/02 (2006.01); B82Y 40/00 (2011.01); H01L 21/304 (2006.01)
CPC C09G 1/02 (2013.01) [B82Y 40/00 (2013.01); H01L 21/304 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A polishing slurry composition comprising:
polishing particles;
a first polishing inhibitor containing a hydrophobic amino acid;
a second polishing inhibitor containing a cyclic polymer;
an oxidizing agent; and
iron (Fe) ions,
wherein:
the first polishing inhibitor and the second polishing inhibitor are different,
the first polishing inhibitor comprises at least one selected from the group consisting of alanine, isoleucine, and proline,
the second polishing inhibitor comprises at least one selected from the group consisting of guar gum, chitin, and dextrin,
the oxidizing agent is in an amount of 0.01 wt % to 5 wt %,
the iron (Fe) ion is in an amount of 0.0001 wt % to 5 wt %, and
a maximum protrusion step of a film surface after polishing a film to be polished using the polishing slurry composition is 70 Å or less.