CPC C08L 63/00 (2013.01) [C08G 59/621 (2013.01); C08J 5/244 (2021.05); C08K 3/013 (2018.01)] | 20 Claims |
1. An epoxy resin composition, wherein the epoxy resin composition comprises
an epoxy resin (A),
a phenolic curing agent (B),
a high molecular-weight resin (C), having structures shown in Formulae (1), (2), (3) and (4), and a weight-average molecular weight of 100,000-200,000; and
an optional inorganic filler (D);
wherein the content of the epoxy resin (A) containing a naphthalene ring skeleton and the phenolic curing agent (B) containing a naphthalene ring skeleton is 0%,
wherein k, l, m and n are mole fractions; k+l+m+n≤1; 0≤k≤0.10; 0.01≤|≤0.30; 0.20≤m≤0.80; 0.05≤n≤0.20; in Formula (2), R1 is a hydrogen atom or an alkyl group with 1-8 carbon atoms; in Formula (3), R2 and R3 are each independently a hydrogen atom or an alkyl group with 1-8 carbon atoms; in Formula (4), R4 is a hydrogen atom or an alkyl group with 1-8 carbon atoms, and R5 is selected from the group consisting of an alkyl group with 1-8 carbon atoms, phenyl (Ph), —COO(CH2)2Ph and —COOCH2Ph;
wherein the epoxy value of the high molecular-weight resin (C) is within the range of 0.10-0.80 eq/kg.
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