US 12,187,850 B2
Polyimide precursor, polyimide precursor composition, polyimide film, method for preparing the same, and use thereof
Jong Chan Kim, Daejeon (KR); and So Young Lee, Daejeon (KR)
Assigned to SK Innovation Co., Ltd., Seoul (KR); and SK ie technology Co., Ltd., Seoul (KR)
Filed by SK Innovation Co., Ltd., Seoul (KR); and SK ie technology Co., Ltd., Seoul (KR)
Filed on Jul. 9, 2021, as Appl. No. 17/371,428.
Claims priority of application No. 10-2020-0085890 (KR), filed on Jul. 13, 2020.
Prior Publication US 2022/0010071 A1, Jan. 13, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. C08G 73/10 (2006.01); C07D 493/10 (2006.01); C07D 495/20 (2006.01); C08J 5/18 (2006.01)
CPC C08G 73/1085 (2013.01) [C07D 493/10 (2013.01); C07D 495/20 (2013.01); C08J 5/18 (2013.01); C08J 2379/08 (2013.01)] 22 Claims
 
1. A polyimide precursor solution comprising: a polymerization component including a tetracarboxylic acid dianhydride represented by the following Chemical Formula 1 and a diamine; and an organic solvent:

OG Complex Work Unit Chemistry
wherein
Q1 is a single bond, —C(═O)—, —C(═O)O—, —C(═O)NH—, —NR′—, —S—, —SO2—, —CH2—, or a combination thereof, wherein R′ is hydrogen or C1-C10 alkyl;
R1 and R2 are independently of each other a halogen, hydroxy, thiol, nitro, cyano, C1-C10 alkyl, C1-C10 alkoxy, C6-C20 aryl, or a combination thereof, or may be connected to an adjacent substituent to form a ring; and
n and m are independently of each other an integer selected from 0 to 4, and when n and m are an integer of 2 or more, R1 and R2 may be the same as or different from each other.