US 12,187,602 B2
Cover member for electronic device, package, electronic device, and electronic module
Sho Yamasaki, Kyoto (JP)
Assigned to KYOCERA Corporation, Kyoto (JP)
Appl. No. 17/763,369
Filed by KYOCERA Corporation, Kyoto (JP)
PCT Filed Sep. 24, 2020, PCT No. PCT/JP2020/036037
§ 371(c)(1), (2) Date Mar. 24, 2022,
PCT Pub. No. WO2021/065672, PCT Pub. Date Apr. 8, 2021.
Claims priority of application No. 2019-178720 (JP), filed on Sep. 30, 2019.
Prior Publication US 2022/0396475 A1, Dec. 15, 2022
Int. Cl. H05K 1/00 (2006.01); B81B 7/00 (2006.01); H05K 1/18 (2006.01); H05K 5/02 (2006.01); H05K 5/03 (2006.01); G01D 11/24 (2006.01)
CPC B81B 7/0061 (2013.01) [H05K 1/181 (2013.01); H05K 5/0213 (2013.01); H05K 5/03 (2013.01); B81B 2201/0257 (2013.01); B81B 2207/09 (2013.01); G01D 11/245 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A cover member for an electronic device comprising:
a through hole extending between a first surface and a second surface; and
a plurality of long particles that are present in at least one inner wall facing the through hole and whose longitudinal direction is along a through axis of the through hole in a cross section including the through axis.