US 12,187,601 B2
Electronic sensors with sensor die in package structure cavity
Barry Jon Male, West Granby, CT (US); Benjamin Cook, Addison, TX (US); Robert Alan Neidorff, Bedford, NH (US); and Steve Kummerl, Carrollton, TX (US)
Assigned to Texas Instruments Incorporated, Dallas, TX (US)
Filed by TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed on Jan. 14, 2019, as Appl. No. 16/247,118.
Application 16/247,118 is a continuation of application No. 15/372,565, filed on Dec. 8, 2016, granted, now 10,179,730.
Prior Publication US 2019/0144267 A1, May 16, 2019
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/28 (2006.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01); H01L 21/02 (2006.01); H01L 21/56 (2006.01); H01L 31/0203 (2014.01)
CPC B81B 7/0048 (2013.01) [B81B 7/0061 (2013.01); B81C 1/00325 (2013.01); B81B 2201/0264 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/181 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A sensor apparatus comprising:
a package structure having an exterior surface, a continuous internal cavity defined by an interior surface, and an opening extending from the cavity through the exterior surface;
a base having a surface exposed to and covering the continuous cavity; and
a sensor structure within the continuous cavity and having an outer surface spaced from the interior surface and spaced from the surface of the base, the sensor structure including:
a first resistor structure unexposed to the cavity;
a second resistor structure electrically coupled to the first resistor structure and having a sensing face exposed to the cavity;
a thermal control circuit configured to control a temperature of the first resistor structure wherein the thermal control circuit includes:
a lateral conductive structure proximate the first resistor structure;
a thermo-electric structure electrically coupled to the lateral conductive structure;
a driver configured to provide a current or voltage signal to the thermo-electric structure to selectively provide heat to, or remove heat from, the lateral conductive structure;
a thermal sensing component configured to sense a temperature of the lateral conductive structure and to provide a first signal to the driver; and
the driver is configured to control the current or voltage signal according to the first signal and a setpoint signal to regulate the temperature of the first resistor structure;
bond pads;
a semiconductor substrate; and
a dielectric layer on a first side of the semiconductor substrate;
the thermal control circuit further includes annular conductive structures laterally outwardly spaced from one another on a first side of the dielectric layer, the annular conductive structures including inner annular conductive structures electrically coupled to the lateral conductive structure and outer annular conductive structures electrically coupled to the bond pads; and
the thermo-electric structure is over portions of the first side of the dielectric layer between the annular conductive structures and configured to transfer heat in stages between the lateral conductive structure and the bond pads.
 
9. A sensor apparatus comprising:
a package structure having an exterior surface, a continuous internal cavity defined by an interior surface, and an opening extending from the cavity through the exterior surface;
a base having a surface exposed to and covering the continuous cavity; and
a sensor structure within the continuous cavity and having an outer surface spaced from the interior surface and spaced from the surface of the base, the sensor structure including:
a resistor structure having top, bottom, and lateral sides exposed to the cavity, wherein one or more of the top, bottom, and lateral sides is a sensing surface;
an amplifier having an input coupled to the resistor structure;
a thermal control circuit configured to control a temperature of the first resistor structure wherein the thermal control circuit includes:
a lateral conductive structure proximate the first resistor structure;
a thermo-electric structure electrically coupled to the lateral conductive structure;
a driver configured to provide a current or voltage signal to the thermo-electric structure to selectively provide heat to, or remove heat from, the lateral conductive structure;
a thermal sensing component configured to sense a temperature of the lateral conductive structure and to provide a first signal to the driver; and
the driver is configured to control the current or voltage signal according to the first signal and a setpoint signal to regulate the temperature of the first resistor structure;
bond pads;
a semiconductor substrate; and
a dielectric layer on a first side of the semiconductor substrate;
the thermal control circuit further includes annular conductive structures laterally outwardly spaced from one another on a first side of the dielectric layer, the annular conductive structures including inner annular conductive structures electrically coupled to the lateral conductive structure and outer annular conductive structures electrically coupled to the bond pads; and
the thermo-electric structure is over portions of the first side of the dielectric layer between the annular conductive structures and configured to transfer heat in stages between the lateral conductive structure and the bond pads.