US 12,187,012 B2
Laminate, electronic equipment and production method for laminate
Takafumi Kuninobu, Chiba (JP); Takeshi Fujiwara, Chiba (JP); Kento Ujiiye, Chiba (JP); and Kazuhiro Takizawa, Chiba (JP)
Assigned to JNC CORPORATION, Tokyo (JP)
Appl. No. 16/499,323
Filed by JNC CORPORATION, Tokyo (JP)
PCT Filed Mar. 29, 2018, PCT No. PCT/JP2018/013502
§ 371(c)(1), (2) Date Sep. 29, 2019,
PCT Pub. No. WO2018/181839, PCT Pub. Date Oct. 4, 2018.
Claims priority of application No. 2017-072256 (JP), filed on Mar. 31, 2017.
Prior Publication US 2021/0101373 A1, Apr. 8, 2021
Int. Cl. B32B 27/08 (2006.01); H01L 23/373 (2006.01); H05K 1/03 (2006.01)
CPC B32B 27/08 (2013.01) [H01L 23/373 (2013.01); H05K 1/0373 (2013.01)] 24 Claims
OG exemplary drawing
 
1. A laminate, comprising:
a thermally conductive first inorganic filler bonded with one end of a first coupling agent;
a thermally conductive second inorganic filler bonded with one end of a second coupling agent, in which a bifunctional or higher functional polymerizable liquid crystal compound is further bonded with the other end of the second coupling agent, a filler bonded with at least one functional group of the polymerizable liquid crystal compound in the other end of the first coupling agent; and
a metal layer bonded with one end of a third coupling agent,
wherein the other end of the third coupling agent is bonded with the other end of the first coupling agent.