US 12,186,939 B2
Method for slicing ingot and wire saw
Keiichi Kanbayashi, Nishigo-mura (JP)
Assigned to SHIN-ETSU HANDOTAI CO., LTD., Tokyo (JP)
Appl. No. 17/042,236
Filed by SHIN-ETSU HANDOTAI CO., LTD., Tokyo (JP)
PCT Filed Apr. 10, 2019, PCT No. PCT/JP2019/015533
§ 371(c)(1), (2) Date Sep. 28, 2020,
PCT Pub. No. WO2019/220820, PCT Pub. Date Nov. 21, 2019.
Claims priority of application No. 2018-94020 (JP), filed on May 15, 2018.
Prior Publication US 2021/0114257 A1, Apr. 22, 2021
Int. Cl. B28D 5/04 (2006.01); B24B 27/06 (2006.01); B28D 5/00 (2006.01)
CPC B28D 5/045 (2013.01) [B24B 27/0633 (2013.01); B28D 5/0082 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A method for slicing a first ingot, comprising:
forming a wire row by a wire spirally wound between a plurality of wire guides, the wire being configured to travel in an axial direction of the wire; and
pressing the first ingot against the wire row while supplying a contact portion between the first ingot and the wire with slurries from a nozzle, thereby slicing the first ingot into wafers, wherein
the slurries are supplied such that slurries whose temperatures are separately controlled by two or more lines of heat exchangers are respectively supplied from two or more divided sections of the nozzle, the two or more divided sections of the nozzle being arranged adjacent to each other along a direction orthogonal to the axial direction of the wire.