US 12,186,900 B2
Substrate cleaning line and substrate cleaning system comprising the same
Hee Sung Chae, Gyeonggi-do (KR); Seung Eun Lee, Seoul (KR); and Geun Sik Yun, Gyeonggi-do (KR)
Assigned to KCTECH Co., Ltd., (KR)
Filed by KCTECH CO., LTD., Gyeonggi-do (KR)
Filed on Feb. 14, 2022, as Appl. No. 17/671,259.
Claims priority of application No. 10-2021-0111944 (KR), filed on Aug. 24, 2021.
Prior Publication US 2023/0065885 A1, Mar. 2, 2023
Int. Cl. B25J 9/04 (2006.01); B25J 11/00 (2006.01); B65G 61/00 (2006.01)
CPC B25J 9/041 (2013.01) [B25J 11/0095 (2013.01); B65G 61/00 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A substrate cleaning system comprising:
a first substrate cleaning line and a second substrate cleaning line, wherein the first substrate cleaning line and the second substrate cleaning line are each disposed at an interval in a horizontal direction; and
a second return robot disposed between the first substrate cleaning line and the second substrate cleaning line to transfer a polished substrate to the first substrate cleaning line or the second substrate cleaning line, the second return robot comprising an arm extendable to approach both the first substrate cleaning line and the second substrate cleaning line,
wherein each of the first substrate cleaning line and the second substrate cleaning line comprises:
a chamber portion comprising a plurality of cleaning chambers to clean a substrate; and
a first return robot to load, unload, or transfer the substrate from or to the plurality of cleaning chambers,
wherein the cleaning chambers are stacked on each other in a vertical direction,
wherein the chamber portion comprises a first chamber portion and a second chamber portion that is disposed at an interval with the first chamber portion in the horizontal direction,
wherein the first return robot is disposed between the first chamber portion and the second chamber portion,
wherein each of the first substrate cleaning line and the second substrate cleaning line further comprises a transferring stage to receive a polished substrate and the second return robot transfers the polished substrate to the transferring stage,
wherein each transferring stage is stacked with the plurality of cleaning chambers in a vertical direction and arranged directly below and/or directly above one of the plurality of cleaning chambers.