US 12,186,855 B2
Polishing pad, method for manufacturing polishing pad, and polishing method
Mitsuru Kato, Kurashiki (JP); Hirofumi Kikuchi, Kurashiki (JP); Chihiro Okamoto, Kurashiki (JP); and Shinya Kato, Tokyo (JP)
Assigned to KURARAY CO., LTD., Kurashiki (JP)
Appl. No. 17/617,118
Filed by KURARAY CO., LTD., Kurashiki (JP)
PCT Filed Jun. 4, 2020, PCT No. PCT/JP2020/022213
§ 371(c)(1), (2) Date Dec. 7, 2021,
PCT Pub. No. WO2020/255744, PCT Pub. Date Dec. 24, 2020.
Claims priority of application No. 2019-114147 (JP), filed on Jun. 19, 2019.
Prior Publication US 2022/0226962 A1, Jul. 21, 2022
Int. Cl. B24B 37/24 (2012.01); B24B 37/26 (2012.01); B24B 53/017 (2012.01)
CPC B24B 37/24 (2013.01) [B24B 37/26 (2013.01); B24B 53/017 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A polishing pad, comprising:
a polishing layer having a polishing surface,
wherein the polishing surface includes a deep-groove region having a first pattern formed by a deep groove or hole having a depth of 0.3 mm or more, and a land region that is a region other than the deep-groove region,
the land region includes shallow recesses having a second pattern, a depth of 0.01 to 0.1 mm and a width of 0.5 to 4 mm, and a plurality of island-like land portions surrounded by the shallow recesses and having a maximum distance in a horizontal direction of 0.5 to 8 mm, and
wherein each of said depths is based on the depth on a polishing surface of an unused polishing pad which has not undergone a break-in treatment.