CPC B23K 26/352 (2015.10) [B23K 26/0006 (2013.01); B23K 26/0622 (2015.10); B23K 26/0853 (2013.01); B23K 26/123 (2013.01); B23K 26/126 (2013.01); B23K 26/354 (2015.10); F27B 5/18 (2013.01); F27D 21/00 (2013.01); H01L 21/2253 (2013.01); H01L 21/268 (2013.01); H01L 21/324 (2013.01); H01L 21/67115 (2013.01); B23K 2103/56 (2018.08); F27B 5/14 (2013.01); F27D 2019/0003 (2013.01); F27D 21/0014 (2013.01)] | 18 Claims |
1. An apparatus for treating a substrate, comprising:
a first laser apparatus comprising a switch and a laser radiation source, wherein the switch directly interrupts a laser radiation supplied by the laser radiation source;
a substrate support movably disposed along an optical path of the laser radiation;
a capacitor and a power supply, wherein the power supply is configured to charge the capacitor;
a controller coupled to the substrate support, the power supply, and the switch, wherein the controller is configured to operate the switch to generate a pulse train of electromagnetic radiation; and
an optical assembly disposed along the optical path of the laser radiation between the first laser apparatus and the substrate support, wherein the optical assembly is positioned to receive the pulses of electromagnetic radiation and direct a pulse train of temporally shaped pulses of electromagnetic radiation, wherein the duration of each pulse is about 1 nsec to about 10 msec.
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