US 12,186,812 B2
Cutting tool
Haruyo Fukui, Osaka (JP); Nozomi Tsukihara, Osaka (JP); and Toshihiro Tabata, Osaka (JP)
Assigned to SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka (JP)
Appl. No. 18/567,780
Filed by Sumitomo Electric Industries, Ltd., Osaka (JP)
PCT Filed May 17, 2023, PCT No. PCT/JP2023/018430
§ 371(c)(1), (2) Date Dec. 7, 2023,
PCT Pub. No. WO2024/236769, PCT Pub. Date Nov. 21, 2024.
Prior Publication US 2024/0383042 A1, Nov. 21, 2024
Int. Cl. B23B 27/14 (2006.01)
CPC B23B 27/148 (2013.01) [B23B 2224/08 (2013.01); B23B 2228/105 (2013.01); B23B 2228/24 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A cutting tool, comprising:
a base; and
a coating disposed on the base, wherein
the coating includes a first A layer,
the first A layer is composed of an alternate layer in which a first unit layer and a third unit layer are alternately stacked,
the first unit layer has a hexagonal crystal structure,
the first unit layer is composed of W(C1-aNa)x,
a represents 0.3 or more and 0.8 or less,
x represents 0.8 or more and 1.2 or less,
the third unit layer is composed of AldCr1-d-eMeN,
M represents silicon, boron, yttrium, cerium, or lanthanum,
d represents 0.40 or more and 0.80 or less, and
e represents more than 0 and 0.05 or less.