US 12,186,161 B2
Drypad with rapid absorption and liquid removal
Caleb Townsend, Davis, IL (US); and Vincent Hahn, Chicago, IL (US)
Assigned to Medline Industries, LP, Northfield, IL (US)
Filed by Medline Industries, LP, Northfield, IL (US)
Filed on Oct. 24, 2023, as Appl. No. 18/493,263.
Application 18/493,263 is a continuation of application No. 16/166,408, filed on Oct. 22, 2018, granted, now 11,839,528.
Prior Publication US 2024/0058175 A1, Feb. 22, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. A61F 13/0203 (2024.01); A61F 13/0206 (2024.01); A61F 13/15 (2006.01); A61F 13/513 (2006.01); A61F 13/53 (2006.01); B32B 5/02 (2006.01); B32B 5/26 (2006.01)
CPC A61F 13/0223 (2013.01) [A61F 13/0209 (2013.01); A61F 13/15268 (2013.01); A61F 13/15617 (2013.01); A61F 13/51305 (2013.01); A61F 2013/15154 (2013.01); A61F 2013/530255 (2013.01); B32B 5/022 (2013.01); B32B 5/26 (2013.01); B32B 2262/067 (2013.01); B32B 2262/14 (2013.01); B32B 2307/716 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A liquid removal drypad comprising:
a structure comprising one or more layers of absorbent material arranged with one or more perforated conduits, the one or more perforated conduits being capable transporting liquid away from the drypad when subject to reduced pressure;
a liquid-permeable nonwoven layer disposed on a first side of the structure, an open electrical circuit comprising conductive ink printed on the liquid-permeable nonwoven layer, the open electrical circuit capable of being closed by conduction of electricity through a body of liquid contacting separate portions of the circuit; and
a hydrophobic layer disposed on a second side of the structure.