CPC H05K 3/1241 (2013.01) [H01L 31/022425 (2013.01); H05K 1/092 (2013.01); H05K 2201/0212 (2013.01); H05K 2201/0215 (2013.01); H05K 2201/0221 (2013.01); H05K 2203/0126 (2013.01); H05K 2203/105 (2013.01); H05K 2203/1131 (2013.01); H05K 2203/163 (2013.01)] | 20 Claims |
1. A process of fabricating a one-dimensional path of aligned one by one particles on the surface of a substrate, wherein
a) a dispersion of electrically conductive particles in an electrically weakly-conductive liquid is prepared, and wherein the value of the dielectric constant of the particles is at least twice that of the dielectric constant of the dispersion liquid, whereas the value of the electrical conductivity of the particles is at least one order of magnitude larger than that of the dispersion liquid;
b) the prepared dispersion is supplied in a continuous manner to at least one electrically conductive microcapillary positioned above and/or below the surface of a substrate;
c) a convex meniscus of the dispersion is formed and maintained at an outlet end of the microcapillary;
d) alternating voltage is provided to the microcapillary to pull a particle out from the dispersion meniscus, so that a structure of aligned one by one particles is formed between the dispersion meniscus and the surface of the substrate; and
e) the microcapillary is moved relative to the substrate and/or the substrate relative to the microcapillary so that the particles of the formed structure of aligned one by one particles are deposited on the surface of the substrate and the one-dimensional structure of aligned one by one particles formed between the dispersion meniscus and the surface of the substrate is rebuilt simultaneously, so that a path of aligned one by one particles is fabricated on the surface of that substrate.
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