US 11,855,608 B2
Systems and methods for packaging an acoustic device in an integrated circuit (IC)
Huan En Ku, Singapore (SG); Joo Shan Yam, Singapore (SG); and Chee Kong Lee, Singapore (SG)
Assigned to RF360 SINGAPORE PTE. LTD., Singapore (SG)
Filed by RF360 Singapore Pte. Ltd., Singapore (SG)
Filed on Aug. 31, 2020, as Appl. No. 17/007,454.
Claims priority of provisional application 63/005,760, filed on Apr. 6, 2020.
Prior Publication US 2021/0313957 A1, Oct. 7, 2021
Int. Cl. H03H 9/17 (2006.01); H03H 3/08 (2006.01); H03H 9/10 (2006.01)
CPC H03H 9/176 (2013.01) [H03H 3/08 (2013.01); H03H 9/1014 (2013.01)] 36 Claims
OG exemplary drawing
 
1. An integrated circuit (IC), comprising:
an IC chip;
a wall positioned on a substrate at least partially underneath the IC chip;
a solder bump coupling the IC chip to the substrate the wall having a wall height less than a solder bump height of the solder bump; and
a gap formed between the wall and the IC chip.