CPC H03H 9/176 (2013.01) [H03H 3/08 (2013.01); H03H 9/1014 (2013.01)] | 36 Claims |
1. An integrated circuit (IC), comprising:
an IC chip;
a wall positioned on a substrate at least partially underneath the IC chip;
a solder bump coupling the IC chip to the substrate the wall having a wall height less than a solder bump height of the solder bump; and
a gap formed between the wall and the IC chip.
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