US 11,855,415 B2
High frequency signal coupling to surface emitters
Xike Liu, Shanghai (CN); Shuiqing Huang, Shanghai (CN); and Rui Gao, Shanghai (CN)
Assigned to Credo Technology Group Limited, Grand Cayman (KY)
Filed by CREDO TECHNOLOGY GROUP LTD, Grand Cayman (KY)
Filed on Mar. 21, 2022, as Appl. No. 17/655,701.
Claims priority of application No. 202111101243.0 (CN), filed on Sep. 18, 2021.
Prior Publication US 2023/0086154 A1, Mar. 23, 2023
Int. Cl. H01S 5/42 (2006.01); H01S 5/02345 (2021.01); H05K 1/18 (2006.01); H05K 1/11 (2006.01); H01R 13/6461 (2011.01); H05K 1/02 (2006.01)
CPC H01S 5/423 (2013.01) [H01R 13/6461 (2013.01); H01S 5/02345 (2021.01); H05K 1/0228 (2013.01); H05K 1/111 (2013.01); H05K 1/183 (2013.01); H05K 2201/10189 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A monolithic integrated circuit chip that comprises:
an array of photoemitter devices arranged in a line on a surface of the monolithic integrated circuit chip, the array having a centerline parallel to a long axis of the array, each photoemitter device having one or more adjacent photoemitter devices in the array and having an anode contact pad on an opposite side of the centerline from the anode contact pads of all adjacent photoemitter devices in the array.