US 11,855,064 B2
Techniques for processing devices
Cyprian Emeka Uzoh, San Jose, CA (US); Laura Wills Mirkarimi, Sunol, CA (US); Guilian Gao, San Jose, CA (US); and Gaius Gillman Fountain, Jr., Youngsville, NC (US)
Assigned to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC., San Jose, CA (US)
Filed by ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC., San Jose, CA (US)
Filed on Jun. 10, 2021, as Appl. No. 17/344,100.
Application 17/344,100 is a continuation of application No. 16/919,989, filed on Jul. 2, 2020, granted, now 11,037,919.
Application 16/919,989 is a continuation of application No. 16/262,489, filed on Jan. 30, 2019, granted, now 10,727,219, issued on Jul. 28, 2020.
Claims priority of provisional application 62/631,216, filed on Feb. 15, 2018.
Prior Publication US 2021/0375850 A1, Dec. 2, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 25/00 (2006.01); H01L 25/065 (2023.01); H01L 23/00 (2006.01); H01L 21/78 (2006.01); H01L 21/683 (2006.01); H01L 21/18 (2006.01)
CPC H01L 25/50 (2013.01) [H01L 21/187 (2013.01); H01L 21/6836 (2013.01); H01L 21/78 (2013.01); H01L 24/27 (2013.01); H01L 24/30 (2013.01); H01L 24/83 (2013.01); H01L 25/0657 (2013.01); H01L 2224/83011 (2013.01); H01L 2224/83013 (2013.01)] 32 Claims
OG exemplary drawing
 
1. A method of forming a microelectronic assembly, the method comprising:
preparing a bonding surface of a first substrate;
preparing a bonding surface of a second substrate;
mounting the second substrate to a dicing support structure;
singulating the second substrate into a plurality of dies while the second substrate is mounted to the dicing support structure, each die of the plurality of dies having a bonding surface comprising a portion of the bonding surface of the second substrate;
activating the bonding surface of the first substrate; and
directly bonding the bonding surface of a die of the plurality of dies to the bonding surface of the first substrate without an adhesive,
wherein the bonding surface of the die is not activated before directly bonding and while the die is mounted to the dicing support structure.