US 11,854,937 B2
Power module apparatus, cooling structure, and electric vehicle or hybrid electric vehicle
Katsuhiko Yoshihara, Kyoto (JP); and Masao Saito, Kyoto (JP)
Assigned to ROHM CO., LTD., Kyoto (JP)
Filed by ROHM CO., LTD., Kyoto (JP)
Filed on Dec. 7, 2020, as Appl. No. 17/114,020.
Application 17/114,020 is a continuation of application No. 16/511,696, filed on Jul. 15, 2019, granted, now 11,011,454.
Application 16/511,696 is a continuation of application No. 15/997,195, filed on Jun. 4, 2018, granted, now 10,403,561, issued on Sep. 3, 2019.
Application 15/997,195 is a continuation of application No. PCT/JP2016/080658, filed on Oct. 17, 2016.
Claims priority of application No. 2015-237458 (JP), filed on Dec. 4, 2015.
Prior Publication US 2021/0111099 A1, Apr. 15, 2021
Int. Cl. H01L 23/473 (2006.01); H02M 7/00 (2006.01); H05K 7/20 (2006.01); B60K 11/02 (2006.01); H01L 25/18 (2023.01); B60K 1/00 (2006.01); H01L 23/495 (2006.01); H01L 23/498 (2006.01); F28F 3/02 (2006.01); F28F 3/04 (2006.01); H01L 23/10 (2006.01); H01L 25/07 (2006.01); H01L 23/367 (2006.01); H02M 7/5387 (2007.01); H02M 1/32 (2007.01); B60K 6/22 (2007.10); H01L 23/00 (2006.01); H01L 25/16 (2023.01); H01L 29/16 (2006.01); H01L 29/739 (2006.01); H01L 29/78 (2006.01)
CPC H01L 23/473 (2013.01) [B60K 1/00 (2013.01); B60K 11/02 (2013.01); F28F 3/022 (2013.01); F28F 3/04 (2013.01); H01L 23/10 (2013.01); H01L 23/49541 (2013.01); H01L 23/49548 (2013.01); H01L 23/49551 (2013.01); H01L 23/49555 (2013.01); H01L 23/49838 (2013.01); H01L 25/072 (2013.01); H01L 25/18 (2013.01); H02M 7/003 (2013.01); H05K 7/209 (2013.01); H05K 7/2089 (2013.01); H05K 7/20927 (2013.01); B60K 6/22 (2013.01); B60K 2001/003 (2013.01); B60Y 2200/91 (2013.01); B60Y 2200/92 (2013.01); F28F 2230/00 (2013.01); H01L 23/3672 (2013.01); H01L 24/32 (2013.01); H01L 25/165 (2013.01); H01L 29/1608 (2013.01); H01L 29/7395 (2013.01); H01L 29/7802 (2013.01); H01L 29/7804 (2013.01); H01L 29/7813 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/49113 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/14252 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19105 (2013.01); H02M 1/327 (2021.05); H02M 7/5387 (2013.01); Y10S 903/904 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A power semiconductor comprising:
a semiconductor device configured to switch electric power;
a first terminal group connected to a power terminal or an output terminal of the semiconductor device;
a second terminal group connected to a control terminal or a sense terminal of the semiconductor device; and
a sealing body configured to seal a perimeter of the semiconductor device and a part of the first terminal group and the second terminal group, wherein
the sealing body includes a heat radiator bonded surface to which a heat radiator is bonded at one surface side, wherein
the first terminal group extends only in a first horizontal direction which is a direction parallel to the heat radiator bonded surface and does not extend in a vertical direction orthogonal to the first horizontal direction,
the second terminal group extends in a second horizontal direction and then extends in a vertical direction which is a direction away from the heat radiator, and
the second horizontal direction in which the second terminal group horizontally extends is orthogonal to the first horizontal direction in which the first terminal group horizontally extends in plan view.