CPC H01L 23/373 (2013.01) [H01L 21/32051 (2013.01); H01L 21/6835 (2013.01); H01L 21/78 (2013.01); H01L 23/53209 (2013.01)] | 17 Claims |
1. An integrated circuit, comprising:
a semiconductor substrate having opposite first and second surfaces, the first surface having a patterned region;
circuitry in the patterned region of the first surface;
a metallic layer on the second surface; and
a carbon layer on the metallic layer.
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