US 11,854,917 B2
Radio-frequency device comprising semiconductor device and waveguide component
Ernst Seler, Munich (DE); Ulrich Moeller, Holzkirchen (DE); and Bernhard Rieder, Regensburg (DE)
Assigned to Infineon Technologies AG, Neubiberg (DE)
Filed by Infineon Technologies AG, Neubiberg (DE)
Filed on Jan. 15, 2021, as Appl. No. 17/248,262.
Claims priority of application No. 102020101293.4 (DE), filed on Jan. 21, 2020.
Prior Publication US 2021/0225719 A1, Jul. 22, 2021
Int. Cl. H01L 23/10 (2006.01); H01L 23/66 (2006.01); H01L 23/053 (2006.01); H01L 23/498 (2006.01); H01L 23/24 (2006.01); H01L 21/48 (2006.01); H01Q 9/04 (2006.01)
CPC H01L 23/10 (2013.01) [H01L 21/4803 (2013.01); H01L 21/4817 (2013.01); H01L 23/053 (2013.01); H01L 23/24 (2013.01); H01L 23/49816 (2013.01); H01L 23/49833 (2013.01); H01L 23/66 (2013.01); H01Q 9/0407 (2013.01); H01L 2223/6677 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A radio-frequency device, comprising:
a semiconductor device, comprising:
a radio-frequency chip, and
a first connection element, which is arranged over a first surface of the semiconductor device and configured to mechanically and electrically connect the semiconductor device to a circuit board; and
a waveguide component arranged over the semiconductor device, comprising:
a waveguide embodied in the waveguide component, and
a second connection element, which is arranged over a second surface of the semiconductor device situated opposite the first surface and which mechanically connects the waveguide component to the semiconductor device,
wherein at least one of the first connection element or the second connection element is an elastic connection element.