US 11,854,884 B2
Fully aligned top vias
Nicholas Anthony Lanzillo, Wynantskill, NY (US); Koichi Motoyama, Clifton Park, NY (US); Somnath Ghosh, Clifton Park, NY (US); Christopher J. Penny, Saratoga Springs, NY (US); Robert Robison, Rexford, NY (US); and Lawrence A. Clevenger, Saratoga Springs, NY (US)
Assigned to INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US)
Filed by INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US)
Filed on Dec. 15, 2021, as Appl. No. 17/551,531.
Application 17/551,531 is a division of application No. 16/678,053, filed on Nov. 8, 2019, granted, now 11,217,481.
Prior Publication US 2022/0108922 A1, Apr. 7, 2022
Int. Cl. H01L 23/532 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01)
CPC H01L 21/76897 (2013.01) [H01L 21/76832 (2013.01); H01L 21/76834 (2013.01); H01L 23/5226 (2013.01); H01L 23/53295 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An aligned top via, comprising:
a fill layer on a conductive line, wherein the fill layer is adjacent to one or more vias;
a spacer layer aligned to an upper surface of the fill layer;
an etch-stop layer on at least a portion of the spacer layer and at least a portion of one of the one or more vias;
one or more cover layer regions on the etch-stop layer; and
a plurality of openings, wherein each of the openings is adjacent to at least one of the one or more cover layer regions, and one of the plurality of openings is at least partially aligned with one of the one or more vias, and another of the plurality of openings is not aligned with the one or more vias.