CPC H01L 21/76897 (2013.01) [H01L 21/76832 (2013.01); H01L 21/76834 (2013.01); H01L 23/5226 (2013.01); H01L 23/53295 (2013.01)] | 20 Claims |
1. An aligned top via, comprising:
a fill layer on a conductive line, wherein the fill layer is adjacent to one or more vias;
a spacer layer aligned to an upper surface of the fill layer;
an etch-stop layer on at least a portion of the spacer layer and at least a portion of one of the one or more vias;
one or more cover layer regions on the etch-stop layer; and
a plurality of openings, wherein each of the openings is adjacent to at least one of the one or more cover layer regions, and one of the plurality of openings is at least partially aligned with one of the one or more vias, and another of the plurality of openings is not aligned with the one or more vias.
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