US 11,854,855 B2
Micro-transfer printing with selective component removal
Erich Radauscher, Raleigh, NC (US); Ronald S. Cok, Rochester, NY (US); Christopher Andrew Bower, Raleigh, NC (US); Matthew Alexander Meitl, Durham, NC (US); and James O. Thostenson, Durham, NC (US)
Assigned to X Display Company Technology Limited, Dublin (IE)
Filed by X Display Company Technology Limited, Dublin (IE)
Filed on Jul. 1, 2020, as Appl. No. 16/919,072.
Application 16/919,072 is a continuation of application No. 16/723,942, filed on Dec. 20, 2019, granted, now 10,796,938.
Application 16/723,942 is a continuation in part of application No. 16/163,559, filed on Oct. 17, 2018, granted, now 10,573,544, issued on Feb. 25, 2020.
Prior Publication US 2020/0335380 A1, Oct. 22, 2020
Int. Cl. H01L 21/78 (2006.01); H01L 21/30 (2006.01); H01L 21/683 (2006.01); H01L 21/56 (2006.01); H01L 21/306 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 25/075 (2006.01); G03F 7/00 (2006.01); H05K 1/11 (2006.01); B29C 59/02 (2006.01)
CPC H01L 21/6835 (2013.01) [B29C 59/026 (2013.01); G03F 7/0002 (2013.01); H01L 21/306 (2013.01); H01L 21/568 (2013.01); H01L 21/7806 (2013.01); H01L 23/3171 (2013.01); H01L 24/24 (2013.01); H01L 24/29 (2013.01); H01L 24/75 (2013.01); H01L 24/97 (2013.01); H01L 25/0753 (2013.01); H01L 25/50 (2013.01); H05K 1/111 (2013.01); H01L 2221/68368 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/95001 (2013.01); H01L 2224/951 (2013.01); H01L 2224/95136 (2013.01); H01L 2924/1815 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A component source wafer, comprising a source wafer having native micro-transfer printable components disposed on or in the source wafer over an etchable sacrificial layer, each of the micro-transfer printable components comprising a device and an ablation layer disposed on a side of the device opposite the source wafer, wherein the source wafer is a semiconductor wafer on which the native micro-transfer printable components have been constructed.