CPC H01L 21/68 (2013.01) [H01L 21/67709 (2013.01); H01L 25/0753 (2013.01); H01L 33/0095 (2013.01); H01L 2933/005 (2013.01)] | 18 Claims |
1. A substrate chuck used for placing semiconductor light-emitting diodes dispersed in a fluid at predetermined positions of a substrate, the substrate chuck comprising:
a substrate support part for supporting the substrate having an assembly electrode;
a vertical moving part which moves the substrate so that one surface of the substrate comes in contact with the fluid in a state in which the substrate is supported by the substrate support;
an electrode connection part configured to apply power to the assembly electrode to generate an electric field so that the semiconductor light-emitting diodes are placed at the predetermined positions of the substrate in a process of moving the semiconductor light-emitting diodes by a position change of at least one magnet; and
a rotating part configured to rotate the substrate support part around a rotating shaft so that the substrate is placed in an upward or downward direction,
wherein the rotating shaft is spaced apart from a center of the substrate support part at a predetermined distance,
wherein the substrate support part comprises:
first and second frames for fixing the substrate from opposite directions; and
a fixing part having a sidewall part for fixing the first and second frames thereto, and
wherein the rotating shaft is disposed at one end of the sidewall part of the fixing part.
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