US 11,854,773 B2
Remote plasma cleaning of chambers for electronics manufacturing systems
Yuanhong Guo, Mountain View, CA (US); Sheng Guo, Santa Clara, CA (US); Marek Radko, San Jose, CA (US); Steve Sansoni, Livermore, CA (US); Xiaoxiong Yuan, San Jose, CA (US); See-Eng Phan, Santa Clara, CA (US); Yuji Murayama, Los Gatos, CA (US); Pingping Gou, San Mateo, CA (US); and Song-Moon Suh, Seoul (KR)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Mar. 26, 2021, as Appl. No. 17/214,707.
Claims priority of provisional application 63/002,994, filed on Mar. 31, 2020.
Prior Publication US 2021/0305028 A1, Sep. 30, 2021
Int. Cl. H01J 37/32 (2006.01)
CPC H01J 37/32825 (2013.01) [H01J 37/32357 (2013.01); H01J 37/32449 (2013.01); H01J 37/32889 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of cleaning a chamber for an electronics manufacturing system, comprising:
machining one or more components of the chamber for the electronics manufacturing system;
assembling the chamber using the one or more components, wherein after assembly the chamber comprises a plurality of organic contaminants;
temporarily connecting a portable remote plasma generator to a port or window of the chamber;
flowing a gas mixture comprising oxygen and a carrier gas into the remote plasma generator;
generating a plasma from the gas mixture by the remote plasma generator;
performing a remote plasma cleaning of the chamber by flowing the plasma into an interior of the chamber, wherein the plasma removes the plurality of organic contaminants from the chamber; and
disconnecting the portable remote plasma generator from the port or window of the chamber after performing the remote plasma cleaning.